规格书 |
|
类型 |
Backplane |
间距 |
2 mm |
行数 |
4 |
触点数 |
96 |
端接方式 |
Press Fit |
安装 |
Through Hole |
触点电镀 |
Gold |
标准包装 |
Bulk |
评论 |
Keyed. Refer to customer print for keying location. |
RoHSELV合规性 |
RoHS compliant, ELV compliant |
Lead Free Solder Processes |
Not relevant for lead free process |
触点材料 |
Phosphor Bronze |
压入后风格 |
Compliant Pin |
PCB安装角度 |
Right Angle |
模块类型 |
Signal |
外壳材料 |
Liquid Crystal Polymer (LCP) |
选择性安装 |
No |
发表类型 |
Press-Fit |
RoHSELV符合记录 |
Always was RoHS compliant |
配合柱长度(毫米( ) ) |
5.00 [0.197] |
触点区域镀层材料 |
Gold (30) |
发表电镀 |
Tin |
排序 |
No |
中心线矩阵(毫米( ) ) |
2.00 x 2.00 [.079 x .079] |
产品类型 |
Fixed-Board (Header) |
信号位置数 |
96 |
额定电压(VAC ) |
30 |
终止(焊接)长度(mm (英寸) ) |
3.36 [0.132] |